Products by Herrmann Ultrasonics, Inc

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  • Contract Packaging

    In order to make use of the many benefits of ultrasonic welding, Herrmann Ultraschall realizes special solutions for many other packaging variants. Thanks to long-term experience in terms of key functions, such as guiding, movement travel, drive, and force build-up, it is possible to implement... Read More
  • Form Fill Seal Module

    The weld tools safely seal the foil even with fine coffee residues present within the sealing zone. This complete solution consists of an ultrasonic generator, stack, guiding rail, force build-up and drive system. The compact, modular design allows for implementation of multi-lane,... Read More
  • HiQ DIALOG Ultrasonic Welding Machine

    As the successor to the legendary Herrmann Ultrasonics HS and PS DIALOG, this new generation machine is equipped with a wealth of innovative features and enhancements. At the heart of this machine is the new pneumatic HMC drive system. It combines the benefits of pneumatics with the dynamics of... Read More
  • HiQ VARIO Ultrasonic Welding Machine

    The HiQ VARIO system series is a very flexible machine that can be configured to fully satisfy the needs of the user. A variety of pneumatic drive units with various strokes and cylinder diameters are available, all of which feature Herrmann’s proven proportional valve technology. Users can also... Read More
  • Top Sealing Module

    The focus is on intermittent sealing of top seals, e.g. of stand-up pouches, despite any product residues present. The vibration of the ultrasonic tool allows for obtaining reliable joint quality despite dusty or pasty filling contents. Burns caused to the packaging material during machine... Read More

    The VE SLIMLINE SOLID has an extremely narrow actuator width. It is equipped with the smallest, most powerful generator on the market that can provide up to 6200W of output power. The electronics were designed for electrical cabinet integration. This efficient actuator system features Fieldbus... Read More

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